Vertiv expands CoolChip CDU range
4th June 2025
FRANCE: Vertiv has expanded its CoolChip range of coolant distribution units with the launch of 70kW, 100kW and 600kW models in Europe, the Middle East and Africa.
These direct-to-chip liquid cooling solutions are being showcased for the first time at this week’s Datacloud Global Congress in Cannes.
The new models are designed to suit retrofit or greenfield data centre environments, with models including in-rack and row-based configurations, and liquid-to-air and liquid-to-liquid technologies.
The CoolChip CDU 70 is an in-row, liquid-to-air coolant distribution unit for data centres retrofitting existing environments or deploying new infrastructure. Designed to utilise existing thermal infrastructure, this liquid-to-air CDU is said to be ideal for facilities looking to deploy liquid cooling capacity without requiring major infrastructure changes.
The system delivers up to 70 kW of cooling capacity, with an integrated controller supporting real-time monitoring, group control and unit-to-unit communication.
Said to be ideal for operators to introduce or expand liquid cooling deployments one rack at a time, the CoolChip CDU 100 supports incremental growth or AI pilot programmes without the need for large-scale infrastructure changes.
It offers 100kW of cooling capacity in a 4U form factor and a large-surface heat exchanger engineered for low approach temperatures.
An integrated controller provides monitoring and control capabilities to streamline operations and enhance visibility. Built-in filtration and precise temperature control within ±1°C helps to maintain fluid quality and thermal stability, while the physical separation of facility and IT loops supports secure, efficient system management in mission-critical environments.
CoolChip CDU 600 is an in-row, liquid-to-liquid model delivering robust, scalable liquid cooling capacity for high-density AI and HPC deployments. The 600kW system is designed to meet the demands of hyperscale and colocation environments, supporting in-row configurations and integrating easily into raised floor or retrofit installations.
Its design, including top or bottom piping connections and available internal manifolds, streamlines infrastructure planning and speeds implementation. It includes redundant pumps and advanced monitoring for temperature and fluid quality.
“As workloads continue to drive higher rack densities and cooling demands, customers need liquid cooling solutions that adapt to their unique deployment strategies, whether retrofitting an existing environment or scaling a new build,” said Sam Bainborough, EMEA vice president of Vertiv’s thermal business.
“The Vertiv CoolChip CDU family offers flexible, scalable solutions that simplify deployment and support long-term growth. By reducing integration complexity and adapting to a range of data centre environments, these CDUs help organisations scale liquid cooling more efficiently.”
