Carrier expands liquid cooling interest
30th April 2026
USA: Carrier has increased its investment in ZutaCore, the US direct-to-chip, waterless liquid cooling solutions company that first attracted its interest last year.
The move expands Carrier’s capabilities in advanced liquid cooling technologies, including interoperable single and two-phase cooling systems. These capabilities enhance Carrier’s broader QuantumLeap suite of thermal and integrated management solutions.
“This investment strengthens our ability to deliver advanced liquid cooling solutions that help customers scale high-density AI infrastructure efficiently and with improved energy performance,” said Christian Senu, Carrier’s global data centres VP.
“Our expanded partnership with Carrier reflects the need for new approaches to data centre cooling,” said ZutaCore’s chairman and CEO, Erez Freibach. “By combining ZutaCore’s waterless, direct-to-chip technology with Carrier’s system-level expertise, we are enabling the next generation of high-density AI data centres.”
California-based ZutaCore’s HyperCool technology uses a closed-loop, two-phase system to remove heat at the source, enabling higher-density AI compute and improved energy efficiency.
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Carrier takes further leap into liquid cooling – 18 February 2025
USA: Carrier Ventures, the investment arm of the Carrier Global Corporation, is backing ZutaCore, a California-based innovator of two-phase direct-to-chip liquid cooling technology for data centres. Read more…
