$100m funding for two-phase liquid cooling firm
2nd June 2026
USA: Mitsubishi Electric, Carrier and Samsung are amongst the investors in a $100m+ Series C funding of California-based two-phase liquid cooling company ZutaCore.
The funding supports global commercialisation expansion as ZutaCore scales to meet rapidly growing bookings and deployments driven by surging demand for AI and high-performance computing infrastructure.
Founded in 2016, ZutaCore is headquartered in San Jose, California, with major R&D operations in Israel. The company’s waterless two-phase cooling platform is designed to support next-generation AI and HPC processors exceeding 4,000W, enabling higher compute density and sustained performance at scale.
With more than 75 deployments worldwide, across the Americas, Europe and Asia, the company continues to collaborate with leading global partners to deliver advanced thermal management solutions.
In the last year, ZutaCore has established a 2MW end-of-row emulation platform at its facility in Israel. This platform replicates real-world thermal and facility interactions without relying on production IT equipment, enabling validation of performance, stability, and integration requirements at multi-megawatt scale while significantly reducing deployment risk for customers.
In parallel, ZutaCore has introduced its OmniTherm cold plate, which enables waterless two-phase cooling for the NVIDIA RTX PRO 6000 Blackwell Server Edition in a single-slot PCIe form factor, supporting full-power operation in standard enterprise and AI cloud server environments.
Related stories:
Carrier expands liquid cooling interest – 30 April 2026
USA: Carrier has increased its investment in ZutaCore, the US direct-to-chip, waterless liquid cooling solutions company that first attracted its interest last year. Read more…
Carrier takes further leap into liquid cooling – 18 February 2025
USA: Carrier Ventures, the investment arm of the Carrier Global Corporation, is backing ZutaCore, a California-based innovator of two-phase direct-to-chip liquid cooling technology for data centres. Read more…
