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LG and Flex to expand data centre business

SOUTH KOREA/USA: LG Electronics has signed an MOU with Flex, a US-based global manufacturer and innovator, to develop integrated, modular cooling solutions for AI-era data centres.

The partnership brings together LG’s high-performance air- and liquid-cooling modules, including CRAC, CRAH, chillers, coolant distribution units (CDUs) and full suite of thermal management and monitoring solutions with Flex’s liquid cooling portfolio, proprietary power products and IT infrastructure solutions. 

LG says it is actively exploring diverse opportunities to expand its data centre business worldwide. In Jakarta, Indonesia, the company recently secured an AI data centre project that is set to become one of the largest of its kind in the country. LG is also collaborating with DataVolt, a global data centre infrastructure provider, on projects in the Middle East and Africa, and has been awarded a contract to supply cooling solutions for a hyperscale data centre under construction in North America.

In addition, LG has partnered with LG Uplus, a telecommunications provider under LG Corp, to successfully complete a proof-of-concept demonstrating advanced liquid cooling technology for data centre thermal management solutions. The company is also developing next-generation CDUs and cold plate solutions scheduled for completion later this year, with commercialisation to follow.

“Through our collaboration with LG, Flex now offers customers a complete range of cooling solutions to tackle escalating heat challenges in the data centre,” said president and COO Michael Hartung. “Together, we’ll deliver prefabricated, scalable data centre infrastructure solutions that incorporate advanced liquid and air cooling technologies to increase efficiency, simplify deployment and speed time to revenue for our customers.”

Co-developed solutions will be available as part of the Flex AI infrastructure platform, the first globally manufactured data centre platform integrating power, cooling, compute and services into modular designs.

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